PRODUCTION OF THICK-FILM HYBRIDS - (TIN IN ELECTRONICS INDUSTRY)

被引：0

作者：

DEAN, RR

机构：

来源：

GALVANOTECHNIK | 1978年 / 69卷 / 11期

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D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：978 / 985

页数：8

共 50 条

[1] THICK-FILM HYBRIDS
WILLIAMS, E
[J]. ELECTRONIC ENGINEERING, 1976, 48 (584): : 77 - &
[2] THICK-FILM MATERIALS FOR HYBRIDS
COLEMAN, M
[J]. RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
[3] CIRCUIT DESIGN FOR THICK-FILM HYBRIDS
TOWERS, TD
[J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 59 - &
[4] STATUS OF COPPER THICK-FILM HYBRIDS
PITKANEN, DE
CUMMINGS, JP
SPEERSCHNEIDER, CJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
[5] ASPECTS OF MULTILAYERED THICK-FILM HYBRIDS
LOASBY, RG
[J]. SOLID STATE TECHNOLOGY, 1971, 14 (05) : 33 - &
[6] ECONOMIC CONSIDERATIONS IN MULTILAYER THICK-FILM HYBRIDS
LOUGHRAN, J
KURZWEIL, K
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 120 - 131
[7] AUTOMATE THICK-FILM PRODUCTION
HUGHES, DC
[J]. CERAMIC AGE, 1968, 84 (02): : 40 - &
[8] SCREENED MULTILAYER CERAMICS FOR THICK-FILM HYBRIDS
IHOCHI, T
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 115 - 119
[9] EPOXIES FOR COMPONENT MOUNTING IN THICK-FILM HYBRIDS
MARSHALL, C
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (03): : 171 - 178
[10] PROGRESS IN MAKING TIN AND THICK-FILM CIRCUITS
HOCKADAY, CH
[J]. ELECTRONIC ENGINEERING, 1969, 41 (495): : 57 - &