SCREENED MULTILAYER CERAMICS FOR THICK-FILM HYBRIDS

被引：1
|
作者：
IHOCHI, T [1 ]
机构：
[1] HITACHI LTD,HYBRID MICROELECTR SECT,TAKASAKI WORKS,TAKASAKI,JAPAN
来源：
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1974年 / PH10卷 / 02期
关键词：
D O I：
10.1109/TPHP.1974.1134847
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：115 / 119
页数：5
相关论文
共 50 条
  • [1] ECONOMIC CONSIDERATIONS IN MULTILAYER THICK-FILM HYBRIDS
    LOUGHRAN, J
    KURZWEIL, K
    [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 120 - 131
  • [2] Multilayer thick-film structures based on spinel ceramics
    Klym, Halyna
    Hadzaman, Ivan
    Ingram, Adam
    Shpotyuk, Oleh
    [J]. CANADIAN JOURNAL OF PHYSICS, 2014, 92 (7-8) : 822 - 826
  • [3] THICK-FILM HYBRIDS
    WILLIAMS, E
    [J]. ELECTRONIC ENGINEERING, 1976, 48 (584): : 77 - &
  • [4] THICK-FILM MATERIALS FOR HYBRIDS
    COLEMAN, M
    [J]. RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
  • [5] CIRCUIT DESIGN FOR THICK-FILM HYBRIDS
    TOWERS, TD
    [J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 59 - &
  • [6] STATUS OF COPPER THICK-FILM HYBRIDS
    PITKANEN, DE
    CUMMINGS, JP
    SPEERSCHNEIDER, CJ
    [J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
  • [7] ASPECTS OF MULTILAYERED THICK-FILM HYBRIDS
    LOASBY, RG
    [J]. SOLID STATE TECHNOLOGY, 1971, 14 (05) : 33 - &
  • [8] THICK-FILM PASTES FOR MULTILAYER USE
    KURZWEIL, K
    LOUGHRAN, J
    [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (04): : 216 - 223
  • [9] THICK-FILM PASTES FOR MULTILAYER USE
    KURZWEIL, K
    LOUGHRAN, J
    [J]. SOLID STATE TECHNOLOGY, 1973, 16 (05) : 36 - 42
  • [10] EPOXIES FOR COMPONENT MOUNTING IN THICK-FILM HYBRIDS
    MARSHALL, C
    [J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (03): : 171 - 178
12345