ECONOMIC CONSIDERATIONS IN MULTILAYER THICK-FILM HYBRIDS

被引：2

作者：

LOUGHRAN, J

KURZWEIL, K

机构：

[1] GE,CORP RES & DEV,SCHENECTADY,NY 12300

[2] CO HONEYWELL BULL,ADV DEV LAB,ST OUEN,FRANCE

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1974年 / PH10卷 / 02期

关键词：

D O I：

10.1109/TPHP.1974.1134843

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：120 / 131

页数：12

共 50 条

[1] SCREENED MULTILAYER CERAMICS FOR THICK-FILM HYBRIDS
IHOCHI, T
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 115 - 119
[2] THICK-FILM HYBRIDS
WILLIAMS, E
[J]. ELECTRONIC ENGINEERING, 1976, 48 (584): : 77 - &
[3] THICK-FILM MATERIALS FOR HYBRIDS
COLEMAN, M
[J]. RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
[4] CIRCUIT DESIGN FOR THICK-FILM HYBRIDS
TOWERS, TD
[J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 59 - &
[5] STATUS OF COPPER THICK-FILM HYBRIDS
PITKANEN, DE
CUMMINGS, JP
SPEERSCHNEIDER, CJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
[6] ASPECTS OF MULTILAYERED THICK-FILM HYBRIDS
LOASBY, RG
[J]. SOLID STATE TECHNOLOGY, 1971, 14 (05) : 33 - &
[7] THICK-FILM PASTES FOR MULTILAYER USE
KURZWEIL, K
LOUGHRAN, J
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (04): : 216 - 223
[8] THICK-FILM PASTES FOR MULTILAYER USE
KURZWEIL, K
LOUGHRAN, J
[J]. SOLID STATE TECHNOLOGY, 1973, 16 (05) : 36 - 42
[9] EPOXIES FOR COMPONENT MOUNTING IN THICK-FILM HYBRIDS
MARSHALL, C
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (03): : 171 - 178
[10] THICK-FILM TERMINATIONS FOR MULTILAYER CERAMIC CAPACITORS
BURKE, DP
STUPAK, RE
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 815 - 815