THICK-FILM HYBRIDS

被引：0

作者：

WILLIAMS, E

机构：

来源：

ELECTRONIC ENGINEERING | 1976年 / 48卷 / 584期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：77 / &

共 50 条

[1] THICK-FILM MATERIALS FOR HYBRIDS
COLEMAN, M
[J]. RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
[2] CIRCUIT DESIGN FOR THICK-FILM HYBRIDS
TOWERS, TD
[J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 59 - &
[3] STATUS OF COPPER THICK-FILM HYBRIDS
PITKANEN, DE
CUMMINGS, JP
SPEERSCHNEIDER, CJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
[4] ASPECTS OF MULTILAYERED THICK-FILM HYBRIDS
LOASBY, RG
[J]. SOLID STATE TECHNOLOGY, 1971, 14 (05) : 33 - &
[5] ECONOMIC CONSIDERATIONS IN MULTILAYER THICK-FILM HYBRIDS
LOUGHRAN, J
KURZWEIL, K
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 120 - 131
[6] SCREENED MULTILAYER CERAMICS FOR THICK-FILM HYBRIDS
IHOCHI, T
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 115 - 119
[7] EPOXIES FOR COMPONENT MOUNTING IN THICK-FILM HYBRIDS
MARSHALL, C
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (03): : 171 - 178
[8] BASE-METAL THICK-FILM HYBRIDS.
Gainey, Trevor
[J]. New Electronics, 1984, 17 (20): : 53 - 54
[9] When do thick-film hybrids make sense?
Huguley, Jeff
[J]. SMT Surface Mount Technology Magazine, 2006, 20 (12):
[10] MACHINE VISION AUTOMATES INSPECTION OF THICK-FILM HYBRIDS
BOLHOUSE, VC
[J]. IEEE CIRCUITS & DEVICES, 1986, 2 (01): : 44 - 48