EPOXIES FOR COMPONENT MOUNTING IN THICK-FILM HYBRIDS

被引：0

作者：

MARSHALL, C

机构：

来源：

ELECTROCOMPONENT SCIENCE AND TECHNOLOGY | 1978年 / 5卷 / 03期

关键词：

D O I：

10.1155/APEC.5.171

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：171 / 178

页数：8

共 50 条

[1] THICK-FILM HYBRIDS
WILLIAMS, E
[J]. ELECTRONIC ENGINEERING, 1976, 48 (584): : 77 - &
[2] THICK-FILM MATERIALS FOR HYBRIDS
COLEMAN, M
[J]. RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
[3] CIRCUIT DESIGN FOR THICK-FILM HYBRIDS
TOWERS, TD
[J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 59 - &
[4] STATUS OF COPPER THICK-FILM HYBRIDS
PITKANEN, DE
CUMMINGS, JP
SPEERSCHNEIDER, CJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
[5] ASPECTS OF MULTILAYERED THICK-FILM HYBRIDS
LOASBY, RG
[J]. SOLID STATE TECHNOLOGY, 1971, 14 (05) : 33 - &
[6] ECONOMIC CONSIDERATIONS IN MULTILAYER THICK-FILM HYBRIDS
LOUGHRAN, J
KURZWEIL, K
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 120 - 131
[7] SCREENED MULTILAYER CERAMICS FOR THICK-FILM HYBRIDS
IHOCHI, T
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 115 - 119
[8] ADJUSTABLE REACTIVE COMPONENTS FOR DIRECT MOUNTING ON THICK-FILM SUBSTRATES
WEBER, RL
[J]. PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1968, (MAY): : 191 - &
[9] PRODUCTION OF THICK-FILM HYBRIDS - (TIN IN ELECTRONICS INDUSTRY)
DEAN, RR
[J]. GALVANOTECHNIK, 1978, 69 (11): : 978 - 985
[10] MACHINE VISION AUTOMATES INSPECTION OF THICK-FILM HYBRIDS
BOLHOUSE, VC
[J]. IEEE CIRCUITS & DEVICES, 1986, 2 (01): : 44 - 48