THICK-FILM MATERIALS FOR HYBRIDS

被引：0

作者：

COLEMAN, M

机构：

来源：

RADIO AND ELECTRONIC ENGINEER | 1982年 / 52卷 / 05期

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D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：227 / 234

页数：8

共 50 条

[1] THICK-FILM HYBRIDS
WILLIAMS, E
[J]. ELECTRONIC ENGINEERING, 1976, 48 (584): : 77 - &
[2] THICK-FILM MATERIALS
SETTY, MS
[J]. ELECTRONICS INFORMATION & PLANNING, 1981, 8 (06): : 436 - 438
[3] CIRCUIT DESIGN FOR THICK-FILM HYBRIDS
TOWERS, TD
[J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 59 - &
[4] STATUS OF COPPER THICK-FILM HYBRIDS
PITKANEN, DE
CUMMINGS, JP
SPEERSCHNEIDER, CJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
[5] ASPECTS OF MULTILAYERED THICK-FILM HYBRIDS
LOASBY, RG
[J]. SOLID STATE TECHNOLOGY, 1971, 14 (05) : 33 - &
[6] TRENDS IN THICK-FILM MATERIALS
MONES, AH
ROSENBERG, RM
[J]. SOLID STATE TECHNOLOGY, 1976, 19 (10) : 47 - 49
[7] THICK-FILM MATERIALS AND RELIABILITY
GRAVES, PW
[J]. ELECTRICAL COMMUNICATION, 1982, 57 (02): : 127 - 131
[8] ECONOMIC CONSIDERATIONS IN MULTILAYER THICK-FILM HYBRIDS
LOUGHRAN, J
KURZWEIL, K
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 120 - 131
[9] SCREENED MULTILAYER CERAMICS FOR THICK-FILM HYBRIDS
IHOCHI, T
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 115 - 119
[10] EPOXIES FOR COMPONENT MOUNTING IN THICK-FILM HYBRIDS
MARSHALL, C
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (03): : 171 - 178