MACHINE VISION AUTOMATES INSPECTION OF THICK-FILM HYBRIDS

被引：1

作者：

BOLHOUSE, VC

机构：

来源：

IEEE CIRCUITS & DEVICES | 1986年 / 2卷 / 01期

关键词：

D O I：

10.1109/MCD.1986.6311770

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：44 / 48

页数：5

共 50 条

[1] MACHINE VISION AUTOMATES INSPECTION OF THICK-FILM HYBRIDS.
Bolhouse, Valarie C.
[J]. 1600, (02):
[2] THICK-FILM HYBRIDS
WILLIAMS, E
[J]. ELECTRONIC ENGINEERING, 1976, 48 (584): : 77 - &
[3] MACHINE-VISION TECHNIQUES FOR INSPECTION OF PRINTED WIRING BOARDS AND THICK-FILM CIRCUITS
SANZ, JLC
JAIN, AK
[J]. JOURNAL OF THE OPTICAL SOCIETY OF AMERICA A-OPTICS IMAGE SCIENCE AND VISION, 1986, 3 (09): : 1465 - 1482
[4] THICK-FILM MATERIALS FOR HYBRIDS
COLEMAN, M
[J]. RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
[5] CIRCUIT DESIGN FOR THICK-FILM HYBRIDS
TOWERS, TD
[J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 59 - &
[6] STATUS OF COPPER THICK-FILM HYBRIDS
PITKANEN, DE
CUMMINGS, JP
SPEERSCHNEIDER, CJ
[J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 141 - 146
[7] ASPECTS OF MULTILAYERED THICK-FILM HYBRIDS
LOASBY, RG
[J]. SOLID STATE TECHNOLOGY, 1971, 14 (05) : 33 - &
[8] ECONOMIC CONSIDERATIONS IN MULTILAYER THICK-FILM HYBRIDS
LOUGHRAN, J
KURZWEIL, K
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 120 - 131
[9] SCREENED MULTILAYER CERAMICS FOR THICK-FILM HYBRIDS
IHOCHI, T
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02): : 115 - 119
[10] EPOXIES FOR COMPONENT MOUNTING IN THICK-FILM HYBRIDS
MARSHALL, C
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (03): : 171 - 178