PROGRESS IN MAKING TIN AND THICK-FILM CIRCUITS

被引：0

作者：

HOCKADAY, CH

机构：

来源：

ELECTRONIC ENGINEERING | 1969年 / 41卷 / 495期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：57 / &

共 50 条

[1] THICK-FILM CIRCUITS
ISERT, H
[J]. ELEKTROTECHNISCHE ZEITSCHRIFT B-AUSGABE, 1972, 24 (04): : 85 - &
[2] LASER TRIMMING OF THICK-FILM RESISTORS AND NEW COMPOSITIONS FOR THICK-FILM CIRCUITS
KAMECKE, W
[J]. INTERNATIONALE ELEKTRONISCHE RUNDSCHAU, 1973, 27 (03): : 63 - 66
[3] DESIGN AND APPLICATION OF THICK-FILM CIRCUITS
BOSWELL, D
RUSSELL, RF
[J]. ELECTRICAL COMMUNICATION, 1974, 49 (01): : 51 - 59
[4] THICK-FILM CIRCUITS FOR TELECOMMUNICATIONS EQUIPMENT
GRUPEN, WB
COHEN, HM
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1981, 8 (1-2): : 9 - 13
[5] MASKS FOR PRINTING THICK-FILM CIRCUITS
DUBEY, GC
[J]. MICROELECTRONICS AND RELIABILITY, 1977, 16 (01): : 69 - 73
[6] Microvaristors in thick-film and LTCC circuits
Mis, Edward
Dziedzic, Andrzej
Mielcarek, Witold
[J]. MICROELECTRONICS RELIABILITY, 2009, 49 (06) : 607 - 613
[7] THICK-FILM RESISTORS FOR KILOVOLT CIRCUITS
LOCKERT, C
[J]. MACHINE DESIGN, 1977, 49 (28) : 156 - 160
[8] ALUMINA SUBSTRATES FOR THICK-FILM CIRCUITS
WATERFIELD, BC
[J]. MICROELECTRONICS RELIABILITY, 1968, 7 (02) : 117 - +
[9] PROGRESS IN THICK-FILM MATERIALS AND PROCESSES
COTE, R
[J]. ELECTRONIC ENGINEERING, 1984, 56 (693): : 173 - 178
[10] CONTROL FACTORS IN MANUFACTURE OF THICK-FILM CIRCUITS
RUSSELL, RF
[J]. MICROELECTRONICS RELIABILITY, 1968, 7 (02) : 121 - &