ALUMINA SUBSTRATES FOR THICK-FILM CIRCUITS

被引：0
|
作者：
WATERFIELD, BC
机构：
来源：
MICROELECTRONICS RELIABILITY | 1968年 / 7卷 / 02期
关键词：
D O I：
10.1016/0026-2714(68)90213-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：117 / +
页数：1
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