THICK-FILM CIRCUITS FOR TELECOMMUNICATIONS EQUIPMENT

被引：0

作者：

GRUPEN, WB

COHEN, HM

机构：

来源：

ELECTROCOMPONENT SCIENCE AND TECHNOLOGY | 1981年 / 8卷 / 1-2期

关键词：

D O I：

10.1155/APEC.8.9

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：9 / 13

页数：5

共 50 条

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SHAH, JS
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 815 - 815
[2] THICK-FILM CIRCUITS
ISERT, H
[J]. ELEKTROTECHNISCHE ZEITSCHRIFT B-AUSGABE, 1972, 24 (04): : 85 - &
[3] LASER TRIMMING OF THICK-FILM RESISTORS AND NEW COMPOSITIONS FOR THICK-FILM CIRCUITS
KAMECKE, W
[J]. INTERNATIONALE ELEKTRONISCHE RUNDSCHAU, 1973, 27 (03): : 63 - 66
[4] DESIGN AND APPLICATION OF THICK-FILM CIRCUITS
BOSWELL, D
RUSSELL, RF
[J]. ELECTRICAL COMMUNICATION, 1974, 49 (01): : 51 - 59
[5] MASKS FOR PRINTING THICK-FILM CIRCUITS
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[6] Microvaristors in thick-film and LTCC circuits
Mis, Edward
Dziedzic, Andrzej
Mielcarek, Witold
[J]. MICROELECTRONICS RELIABILITY, 2009, 49 (06) : 607 - 613
[7] THICK-FILM RESISTORS FOR KILOVOLT CIRCUITS
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[8] ALUMINA SUBSTRATES FOR THICK-FILM CIRCUITS
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[J]. MICROELECTRONICS RELIABILITY, 1968, 7 (02) : 117 - +
[9] CONTROL FACTORS IN MANUFACTURE OF THICK-FILM CIRCUITS
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[J]. MICROELECTRONICS RELIABILITY, 1968, 7 (02) : 121 - &
[10] THICK-FILM NICKEL METALLIZATION FOR ELECTRONIC CIRCUITS
SHIH, TT
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[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 326 - 326