Design Technology Co-optimization for Enabling 5nm gate-all-around Nanowire 6T SRAM

被引:0
|
作者
Huynh-Bao, Trong [1 ,2 ]
Sakhare, Sushil [1 ]
Ryckaert, Julien [1 ]
Yakimets, Dmitry [1 ,3 ]
Mercha, Abdelkarim [1 ]
Verkest, Diederik [1 ,2 ]
Thean, Aaron Voon-Yew [1 ]
Wambacq, Piet [1 ,2 ]
机构
[1] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
[2] Vrije Univ Brussel, ETRO, Brussels, Belgium
[3] Katholieke Univ Leuven, ESAT, Heverlee, Belgium
关键词
5nm; CMOS scaling; DTCO; embedded memory; gate-all-around FETs; nanowire; on-chip variation; parametric yield; 6T SRAM; vertical FET; Vmin;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper presents a comprehensive benchmarking and co-optimization of 6T SRAM bitcells designed with 5nm vertical and lateral gate-all-around nanowire FET technology for the first time. A variety of 6T SRAM bitcells configurations combined with different device integration scenarios will be discussed. Our results show that an ultra-dense SRAM bitcell (0.01 um2) can be achieved with vertical FET architecture. The bitcell designed with vertical FET are preferably targeted for low power applications while the lateral FET-based SRAM bitcells could provide 4.5x higher in performance, but resulting in a penalty of 17x increasing in the leakage current compared to the vertical designs. A Vmin of 0.45 V could be obtained for 122 SRAM bitcells implemented with vertical devices.
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页数:4
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