Study on Interconnect Test with Multiple Scan Chains Based on VXIbus Boundary Scan Module

被引：0

作者：

Yin Xianhua ^{[1
]}

Zhu Wangchun ^{[1
]}

Mo Taiping ^{[1
]}

机构：

[1] Guilin Univ Elect Technol, Elect Engineer Sch, Guilin 541004, Peoples R China

来源：

PROCEEDINGS OF THE SECOND INTERNATIONAL SYMPOSIUM ON TEST AUTOMATION & INSTRUMENTATION, VOLS 1-2 | 2008年

关键词：

boundary scan; multiple scan chains; interconnect test;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The use of multiple scan chains for interconnect test is analyzed. Based on the researches on greedy strategy for configuring multiple scan chains for internal test and the sorting algorithm of single scan chain for Cluster test, a solution of configuring and optimizing multiple scan chains for interconnect test is presented. It will aim to decrease the test time and increase the efficiency and reliability for interconnect test: significantly. Experiment results show that the expected design objective is achieved.

引用

页码：119 / 123

页数：5

共 50 条

[41] Embedded test complements boundary scan
Nelson, Rick
EE: Evaluation Engineering, 2012, 51 (10): : 22 - 26
[42] THE IMPACT OF BOUNDARY SCAN ON BOARD TEST
PARKER, KP
IEEE DESIGN & TEST OF COMPUTERS, 1989, 6 (04): : 18 - 30
[43] WORKING WITH BOUNDARY-SCAN TEST
BISHOP, L
ELECTRONIC PRODUCTS MAGAZINE, 1993, 35 (10): : 65 - 71
[44] Reducing the cost of test with boundary scan
Goepel, H
EE-EVALUATION ENGINEERING, 2004, 43 (01): : 28 - 33
[45] Using boundary-scan test
de Jong, Frans, 1600, (29):
[46] Matsushita uses boundary scan test
Test & Measurement World, 1995, 15 (02):
[47] Test goes lean with boundary scan
Plunkett, Dominic
SMT Surface Mount Technology Magazine, 2007, 21 (02):
[48] Design for boundary-scan test
Journal of Japan Institute of Electronics Packaging, 2020, 23 (03) : 243 - 247
[49] Working with boundary-scan test
Electronic Products (Garden City, New York), 1993, 35 (10):
[50] Optimal scheduling algorithm for testing interconnect using boundary scan
Lien, Jung-Cheun
Breuer, Melvin A.
Journal of Electronic Testing: Theory and Applications (JETTA), 1991, 2 (01): : 117 - 130

← 1 2 3 4 5 →