CHIP-LEVEL MODELING WITH HDLS

被引:3
|
作者
ARMSTRONG, JR [1 ]
机构
[1] VIRGINIA POLYTECH INST & STATE UNIV,VHDL ANAL & STANDARDIZAT GRP,BLACKSBURG,VA 24061
来源
IEEE DESIGN & TEST OF COMPUTERS | 1988年 / 5卷 / 01期
关键词
COMPUTER HARDWARE DESCRIPTION LANGUAGES - FAILURE ANALYSIS;
D O I
10.1109/54.667
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
VLSI circuits have made gate-level modeling of large-scale systems impractical. Chip-level modeling offers an alternative approach to model development that still represents timing accurately. The authors examine this approach to modeling and the use of hardware description languages (HDLs) to achieve the desired accuracy. The characteristics of chip-level models are reviewed and sample models are presented. HDL code for each model is given to illustrate it use. Fault modeling at the chip level is examined.
引用
收藏
页码:8 / 18
页数:11
相关论文
共 50 条
  • [1] Chip-level Modeling and Analysis of Electrical Masking of Soft Errors
    Kiamehr, Saman
    Ebrahimi, Mojtaba
    Firouzi, Farshad
    Tahoori, Mehdi B.
    [J]. 2013 IEEE 31ST VLSI TEST SYMPOSIUM (VTS), 2013,
  • [2] CHIP-LEVEL SIMULATION OF MICROPROCESSORS
    ARMSTRONG, JR
    WOODRUFF, GW
    [J]. COMPUTER, 1980, 13 (01) : 94 - 100
  • [3] Chip-level microarchitecture trends
    Bose, P
    [J]. IEEE MICRO, 2004, 24 (02) : 5 - 5
  • [4] Package and chip-level EMI/EMC structure design, modeling and simulation
    Diaz-Alvarez, E
    Krusius, JP
    [J]. 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 873 - 878
  • [5] Radiation-induced Soft Errors: A Chip-level Modeling Perspective
    Seifert, Norbert
    [J]. FOUNDATIONS AND TRENDS IN ELECTRONIC DESIGN AUTOMATION, 2010, 4 (2-3): : 99 - 221
  • [6] Efficient techniques for modeling chip-level interconnect, substrate and package parasitics
    Feldmann, P
    Kapur, S
    Long, DE
    [J]. DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION 1999, PROCEEDINGS, 1999, : 418 - 422
  • [7] Package and chip-level EMI/EMC structure design, modeling and simulation
    Diaz-Alvarez, E.
    Krusius, J.P.
    [J]. Proceedings - Electronic Components and Technology Conference, 1999, : 873 - 878
  • [8] A CHIP-LEVEL MODELING APPROACH FOR RAIL SPAN COLLAPSE AND SURVIVABILITY ANALYSES
    MAVIS, DG
    ALEXANDER, DR
    DINGER, GL
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1989, 36 (06) : 2239 - 2246
  • [9] A Survey of Chip-level Thermal Simulators
    Sultan, Hameedah
    Chauhan, Anjali
    Sarangi, Smruti R.
    [J]. ACM COMPUTING SURVEYS, 2019, 52 (02)
  • [10] A Chip-Level Optical Interconnect for CPU
    Hao, Qinfen
    Qin, Mengyuan
    Qi, Nan
    Xue, Haiyun
    Han, Meng
    Li, Xiaolin
    Hao, Kai
    Niu, Xingmao
    Xiao, Limin
    Fan, Dongrui
    Kurata, Kazuhiko
    [J]. IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 33 (16) : 852 - 855