Package and chip-level EMI/EMC structure design, modeling and simulation

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作者：
Diaz-Alvarez, E. [1 ]
Krusius, J.P. [1 ]
机构：
[1] Cornell Univ, Ithaca, United States
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
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页码：873 / 878
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