A Paradigm of Carbon Nanotube Interconnects in Microelectronic Packaging

被引：0
|
作者：
Yangyang Sun
Lingbo Zhu
Hongjin Jiang
Jiongxin Lu
Wei Wang
C.P. Wong
机构：
[1] Georgia Institute of Technology,School of Materials Science and Engineering
[2] Georgia Institute of Technology,School of Chemistry and Biochemistry
[3] Georgia Institute of Technology,School of Chemical and Biomolecular Engineering
来源：
Journal of Electronic Materials | 2008年 / 37卷
关键词：
Carbon nanotubes; transfer; interconnect; ohmic contact;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Carbon nanotube (CNT) arrays/films were transferred onto copper substrates via eutectic tin/lead (SnPb) solder pastes. The morphologies, thermal stabilities, adhesion to substrates, and electrical properties of the as-transferred CNT arrays were studied. The CNT arrays generated negligible expansion or contraction below 250°C. The adhesion of CNT arrays to the substrate was significantly improved by the transfer process. An ohmic contact was formed between the transferred CNT arrays and the Sn-Pb solder. Four-probe electrical measurements yielded the resistance of the as-transferred CNT films under the electrode to be around 0.0056 Ω, from which the resistivity of each individual CNT tube was calculated to be 2.44 × 10−4 Ω cm.
引用
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页码：1691 / 1697
页数：6
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