Microelectronic interconnects based on carbon nanotubes

被引：0

作者：

Kreupl, F ^{[1
]}

Graham, AP ^{[1
]}

Liebau, M ^{[1
]}

Duesberg, GS ^{[1
]}

Seidel, R ^{[1
]}

Unger, E ^{[1
]}

机构：

[1] Infineon Technol, Corp Res, D-81739 Munich, Germany

来源：

ADVANCED METALLIZATION CONFERENCE 2004 (AMC 2004) | 2004年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Carbon nanotubes have emerged as a possible new material for electronic applications. They show promising characteristics for transistors as well as for interconnects. Here we review their basic properties and focus on the status of nanotubes with respect to their application as interconnects and discuss the challenges facing their integration.

引用

页码：285 / 291

页数：7

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