A paradigm of carbon nanotube interconnects in microelectronic packaging

被引：25
|
作者：
Sun, Yangyang [1 ,2 ]
Zhu, Lingbo [3 ]
Jiang, Hongjin [1 ,2 ]
Lu, Jiongxin [1 ]
Wang, Wei [1 ]
Wong, C. P. [1 ,2 ]
机构：
[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, Sch Chem & Biochem, Atlanta, GA 30332 USA
[3] Georgia Inst Technol, Sch Chem & Biomol Engn, Atlanta, GA 30332 USA
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 11期
关键词：
carbon nanotubes; transfer; interconnect; ohmic contact;
D O I：
10.1007/s11664-008-0533-1
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Carbon nanotube (CNT) arrays/films were transferred onto copper substrates via eutectic tin/lead (SnPb) solder pastes. The morphologies, thermal stabilities, adhesion to substrates, and electrical properties of the as-transferred CNT arrays were studied. The CNT arrays generated negligible expansion or contraction below 250 degrees C. The adhesion of CNT arrays to the substrate was significantly improved by the transfer process. An ohmic contact was formed between the transferred CNT arrays and the Sn-Pb solder. Four-probe electrical measurements yielded the resistance of the as-transferred CNT films under the electrode to be around 0.0056 Omega, from which the resistivity of each individual CNT tube was calculated to be 2.44 x 10(-4) Omega cm.
引用
收藏
页码：1691 / 1697
页数：7
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