An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging

被引：0

作者：

Chen, Shujing ^{[1
]}

Shan, Bo ^{[1
]}

Yang, Yiqun ^{[1
]}

Yuan, Guangjie ^{[1
]}

Huang, Shirong ^{[1
]}

Lu, Xiuzhen ^{[1
]}

Zhang, Yan ^{[1
]}

Fu, Yifeng ^{[2
]}

Ye, Lilei

Liu, Johan ^{[1
,2
]}

机构：

[1] Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai, Peoples R China

[2] Chalmers Univ Technol, Dept Microtechnol & Nanosci MC2, Elect Mat & Syst Lab, SE-41296 Gothenburg, Sweden

来源：

2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC) | 2017年

关键词：

Interconnect; CNTs based bumps; CNTs basednTSVs; resistivity; CNTs-Cu nanocomposite; THROUGH-SILICON VIAS; FLIP-CHIP; FAILURE ANALYSIS; LOW-TEMPERATURE; BUMPS; GROWTH;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.

引用

页码：113 / 119

页数：7

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