Overview of recent developments in microelectronic packaging

被引：5
|
作者：
Chen, WT [1 ]
Tseng, A [1 ]
机构：
[1] ASE US Inc, Santa Clara, CA USA
来源：
ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001 | 2001年
关键词：
D O I：
10.1109/EMAP.2001.983949
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：15 / 16
页数：2
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