A Paradigm of Carbon Nanotube Interconnects in Microelectronic Packaging

被引：0
|
作者：
Yangyang Sun
Lingbo Zhu
Hongjin Jiang
Jiongxin Lu
Wei Wang
C.P. Wong
机构：
[1] Georgia Institute of Technology,School of Materials Science and Engineering
[2] Georgia Institute of Technology,School of Chemistry and Biochemistry
[3] Georgia Institute of Technology,School of Chemical and Biomolecular Engineering
来源：
Journal of Electronic Materials | 2008年 / 37卷
关键词：
Carbon nanotubes; transfer; interconnect; ohmic contact;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Carbon nanotube (CNT) arrays/films were transferred onto copper substrates via eutectic tin/lead (SnPb) solder pastes. The morphologies, thermal stabilities, adhesion to substrates, and electrical properties of the as-transferred CNT arrays were studied. The CNT arrays generated negligible expansion or contraction below 250°C. The adhesion of CNT arrays to the substrate was significantly improved by the transfer process. An ohmic contact was formed between the transferred CNT arrays and the Sn-Pb solder. Four-probe electrical measurements yielded the resistance of the as-transferred CNT films under the electrode to be around 0.0056 Ω, from which the resistivity of each individual CNT tube was calculated to be 2.44 × 10−4 Ω cm.
引用
收藏
页码：1691 / 1697
页数：6
相关论文
共 50 条
  • [31] Carbon Nanotube Interconnects for Nanoelectronic Integrated Systems
    Nogueira, C. P. S. M.
    Guimaraes, J. G.
    [J]. IEEE LATIN AMERICA TRANSACTIONS, 2017, 15 (05) : 813 - 818
  • [32] Electromagnetic and Circuital Modeling of Carbon Nanotube Interconnects
    Maffucci, A.
    Miano, G.
    Villone, F.
    [J]. ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1051 - +
  • [33] Carbon nanotube technologies for LSI via interconnects
    Awano, Yuji
    [J]. IEICE TRANSACTIONS ON ELECTRONICS, 2006, E89C (11): : 1499 - 1503
  • [34] Temperature Effects on Crosstalk in Carbon Nanotube Interconnects
    Jia, Lei
    Yin, Wen-Yan
    [J]. APMC: 2008 ASIA PACIFIC MICROWAVE CONFERENCE (APMC 2008), VOLS 1-5, 2008, : 3172 - 3175
  • [35] Crosstalk analysis of carbon nanotube bundle interconnects
    School of Electronics Information Engineering, Tianjin Key Laboratory of Film Electronic and Communication Devices, Tianjin University of Technology, Tianjin, 300384, China
    不详
    [J]. Nanoscale Res. Lett., (1-5):
  • [36] Parameterized SPICE Models of Carbon Nanotube Interconnects
    Gadjeva, Elissaveta
    Popova, Petya
    Hristov, Marin
    Angelov, George
    [J]. 2016 39TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2016, : 361 - 366
  • [37] Crosstalk analysis of carbon nanotube bundle interconnects
    Zhang, Kailiang
    Tian, Bo
    Zhu, Xiaosong
    Wang, Fang
    Wei, Jun
    [J]. NANOSCALE RESEARCH LETTERS, 2012, 7
  • [38] Quantum Capacitance Extraction for Carbon Nanotube Interconnects
    Parkash, Vidur
    Goel, Ashok K.
    [J]. NANOSCALE RESEARCH LETTERS, 2010, 5 (09): : 1424 - 1430
  • [39] Crosstalk analysis of carbon nanotube bundle interconnects
    Kailiang Zhang
    Bo Tian
    Xiaosong Zhu
    Fang Wang
    Jun Wei
    [J]. Nanoscale Research Letters, 7
  • [40] Carbon Nanotube/Conducting Polymer Addressable Interconnects
    Lee, S. W.
    Katz, D.
    Grebel, H.
    Lopez, D.
    Kornblit, A.
    [J]. 2007 CONFERENCE ON LASERS & ELECTRO-OPTICS/QUANTUM ELECTRONICS AND LASER SCIENCE CONFERENCE (CLEO/QELS 2007), VOLS 1-5, 2007, : 1097 - +
12345