Analytical estimation of interconnect loss due to dummy fills

被引：0
|
作者：
Tsuchiya, Akira [1 ]
Onodera, Hidetoshi [1 ]
机构：
[1] Kyoto Univ, Dept Commun & Comp Engn, Sakyo Ku, Yoshida Honmachi, Kyoto 6068501, Japan
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper proposes an analytical method to estimate the interconnect loss due to dummy fills. By modeling the eddy current in dummy fills as a simple square loop, we derive the impact of dummy fills on the loss of the interconnect We verified the proposed method by a 3D field solver. Experimental results show that the proposed method provides accurate modeling of the effect of dummy fills.
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页码：149 / +
页数：2
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