Analytical estimation of interconnect loss due to dummy fills

被引：0

作者：

Tsuchiya, Akira ^{[1
]}

Onodera, Hidetoshi ^{[1
]}

机构：

[1] Kyoto Univ, Dept Commun & Comp Engn, Sakyo Ku, Yoshida Honmachi, Kyoto 6068501, Japan

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper proposes an analytical method to estimate the interconnect loss due to dummy fills. By modeling the eddy current in dummy fills as a simple square loop, we derive the impact of dummy fills on the loss of the interconnect We verified the proposed method by a 3D field solver. Experimental results show that the proposed method provides accurate modeling of the effect of dummy fills.

引用

页码：149 / +

页数：2

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