SOI-DRAM circuit technologies: For low power high speed multigiga scale memories

被引:4
|
作者
Kuge, S
Morishita, F
Tsuruda, T
Tomishima, S
Tsukude, M
Yamagata, T
Arimoto, K
机构
[1] ULSI Laboratory, Mitsubishi Electric Corporation, Itami, Hyogo
[2] Kyusu University, Fukuoka
[3] ULSI Laboratory, Mitsubishi Electric Corporation, Itami
[4] Keio University, Tokyo
[5] Okayama University, Okayama
[6] Mitsubishi Electric Corporation, Itami
[7] Osaka University, Osaka
[8] Hiroshima University, Hiroshima
[9] ULSI Laboratory, Mitsubishi Electric Corporation, Itami, Hyogo
[10] LSI R. and D. Laboratory, Mitsubishi Electric Corporation, Itami, Hyogo
关键词
D O I
10.1109/4.499736
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes a silicon on insulator (SOI) DRAM which has a body bias controlling technique for high-speed circuit operation and a new type of redundancy for low standby power operation, aimed at high yield, The body bias controlling technique contributes to super-body synchronous sensing and body-bias controlled logic, The super-body synchronous sensing achieves 3.0 ns faster sensing than body synchronous sensing and the body-bias controlled logic realizes 8.0 ns faster peripheral logic operation compared with a conventional logic scheme, at 1.5 V in a 4 Gb-level SOI DRAM. The body-bias controlled legit also realizes a body-bias change current reduction of 1/20, compared with a bulk well-structure, A new type of redundancy that overcomes the standby current failure resulting from a wordline-bitline short is also discussed in respect of yield and area penalty.
引用
收藏
页码:586 / 591
页数:6
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