Homogeneous Integration for 3D IC with TSV

被引：0
|
作者：
Kwai, Ding-Ming [1 ]
机构：
[1] Ind Technol Res Inst, SoC Technol Ctr, Hsinchu, Taiwan
来源：
2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010) | 2010年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Three-dimensional (3D) integration with through-silicon via (TSV) is an emerging technology which has been expected to lead to an industry paradigm shift. Will the industry steam forward with the gusto of 3D IC with TSV? I consider its success in homogeneous integration by looking forward the solution to the following three awareness problems: variability, TSV, and thermal.
引用
收藏
页码：538 / 539
页数：2
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