Homogeneous Integration for 3D IC with TSV

被引：0
|
作者：
Kwai, Ding-Ming [1 ]
机构：
[1] Ind Technol Res Inst, SoC Technol Ctr, Hsinchu, Taiwan
来源：
2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010) | 2010年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Three-dimensional (3D) integration with through-silicon via (TSV) is an emerging technology which has been expected to lead to an industry paradigm shift. Will the industry steam forward with the gusto of 3D IC with TSV? I consider its success in homogeneous integration by looking forward the solution to the following three awareness problems: variability, TSV, and thermal.
引用
收藏
页码：538 / 539
页数：2
相关论文
共 50 条
  • [31] Electrical Analyses of TSV-RDL-Bump of Interposers for High-Speed 3D IC Integration
    Sung, Tseshih
    Chiang, Kevin
    Lee, Daniel
    Ma, Mike
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 865 - 870
  • [32] TSV-aware Scan Chain Reordering for 3D IC
    Datta, Ayan
    Nagarajan, Charudhattan
    Kolay, Susmita Sur
    2011 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI), 2011, : 188 - 193
  • [33] TSV NOISE COUPLING IN 3D IC USING GUARD RING
    Reddy, R. Ranga
    Tanna, Sugandh
    Singh, Shiv Govind
    Singh, Om Krishna
    2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
  • [34] A Thermal-Aware Distribution Method of TSV in 3D IC
    Hou, Ligang
    Fu, Jingyan
    Wang, Jinhui
    Gong, Na
    Zhao, Wei
    Geng, Shuqin
    PROCEEDINGS OF 2015 IEEE 11TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2015,
  • [35] TSV-Aware Analytical Placement for 3D IC Designs
    Hsu, Meng-Kai
    Chang, Yao-Wen
    Balabanov, Valeriy
    PROCEEDINGS OF THE 48TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2011, : 664 - 669
  • [36] 3D IC Integration Using Blockchain
    Radeep Krishna, R.
    Sivakumar, P.
    Abraham, C.G.
    Sreedivya, K.M.
    Lecture Notes in Networks and Systems, 2023, 540 : 317 - 344
  • [37] Mapping progress in 3D IC integration
    LoPiccolo, P
    SOLID STATE TECHNOLOGY, 2006, 49 (06) : 34 - +
  • [38] Monolithic 3D IC vs. TSV-based 3D IC in 14nm FinFET Technology
    Samal, Sandeep Kumar
    Nayak, Deepak
    Ichihashi, Motoi
    Banna, Srinivasa
    Lim, Sung Kyu
    2016 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2016,
  • [39] Front to backside alignment for TSV based 3D integration
    Windrich, Frank
    Schenke, Andreas
    2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
  • [40] Electrical Measurement and Analysis of TSV/RDL for 3D Integration
    Sun, Xin
    Fang, Runiu
    Zhu, Yunhui
    Zhong, Xiao
    Bian, Yuan
    Ma, Shenglin
    Miao, Min
    Chen, Jing
    Wang, Yan
    Jin, Yufeng
    2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 709 - 712
12345