Homogeneous Integration for 3D IC with TSV

被引：0
|
作者：
Kwai, Ding-Ming [1 ]
机构：
[1] Ind Technol Res Inst, SoC Technol Ctr, Hsinchu, Taiwan
来源：
2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010) | 2010年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Three-dimensional (3D) integration with through-silicon via (TSV) is an emerging technology which has been expected to lead to an industry paradigm shift. Will the industry steam forward with the gusto of 3D IC with TSV? I consider its success in homogeneous integration by looking forward the solution to the following three awareness problems: variability, TSV, and thermal.
引用
收藏
页码：538 / 539
页数：2
相关论文
共 50 条
  • [1] Evolution and Outlook of TSV and 3D IC/Si Integration
    Lau, John H.
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 560 - 570
  • [2] TSV Manufacturing Yield and Hidden Costs for 3D IC Integration
    Lau, John H.
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1031 - 1042
  • [3] Effects of TSV Interposer on the Reliability of 3D IC Integration SiP
    Lau, John H.
    Zhang, Xiaowu
    PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, : 65 - +
  • [4] Thermal management in TSV based 3D IC Integration: A survey
    Sanipini, Venkata Kiran
    Rakesh, Banothu
    Chamanthula, Aruna Jyothi
    Santoshi, N.
    Gudivada, A. Arunkumar
    Panigrahy, Asisa Kumar
    MATERIALS TODAY-PROCEEDINGS, 2021, 45 : 1742 - 1746
  • [5] TSV Interposers with Embedded Microchannels for 3D IC and LED Integration
    Lau, John
    Chien, Heng-Chieh
    Tain, Ray
    PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 2, 2012, : 297 - 304
  • [6] The thermal stress analysis in 3D IC integration with TSV interposer
    Pang, Junwen
    Wang, Jun
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 724 - 729
  • [7] Co-process Technology of the TSV and Embedded IC for 3D heterogeneous IC Integration
    Yook, Jong-Min
    Kim, Seong-Ryul
    Lee, Won-Cheol
    Kim, Dong-Su
    Kim, Jun-Chul
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [8] Thermal Management of 3D IC Integration with TSV (Through Silicon Via)
    Lau, John H.
    Yue, Tang Gong
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 635 - +
  • [9] 3D IC with TSV: Status and developments
    Vardaman, E. Jan
    SOLID STATE TECHNOLOGY, 2013, 56 (02) : 12 - 12
  • [10] Simulation in 3D Integration and TSV
    Weide-Zaage, K.
    Moujbani, A.
    Kludt, J.
    2014 IEEE 5TH LATIN AMERICAN SYMPOSIUM ON CIRCUITS AND SYSTEMS (LASCAS), 2014,
12345