Electrical modeling and simulation challenges in chip-package codesign

被引：11
|
作者：
Cangellaris, AC [1 ]
机构：
[1] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
来源：
IEEE MICRO | 1998年 / 18卷 / 04期
关键词：
D O I：
10.1109/40.710871
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
High-performance, multifunctional systems demand novel, often revolutionary, practices in functional-block integration and packaging. Independent chip, package, and board design will have to give way to a holistic approach.
引用
收藏
页码：50 / 59
页数：10
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