High-pin-count packaging technologies for LSI devices

被引：0
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作者：
Tomita, Y
Ueda, N
机构：
来源：
MITSUBISHI ELECTRIC ADVANCE | 1996年 / 75卷
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：36 / 37
页数：2
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