High Performance, Low Pin Count Packaging

Advanced packaging conferences, technical articles, and editorials frequently focus on high pin count devices such as microprocessors and graphic processor devices. The substantial challenges incumbent on high I/O package designs warrant this attention. However, an entire universe of high performance packages with low pin counts also exist. Diodes, power transistors, RFIDs, engine controllers, and MEMs devices rarely demand more than eight terminals and often only require two. Almost all systems employ at least some low pin count devices. On the other hand, applications such as alternative energy equipment, LED lighting, automotive electronics, and ubiquitous sensor networks consist primarily of high performance, low pin count devices. In this paper the authors review families of applications that rely on high performance, low pin count devices and identify application-specific requirements such as power delivery, thermal management, signal integrity, and reliability. Next the paper analyzes the strengths and weaknesses of various packaging strategies, both traditional and emerging, developed for these applications. Specific package types considered include wire-bond, flip chip, hybrid, and embedded packaging as well as new approaches based on printed conductors, conductive adhesives, flexible substrates, and organic electronics. Finally, the authors assess the opportunities and challenges associated with packaging high performance, low pin count devices.