3D thermal-aware floorplanner using a MILP approximation

被引：8
|
作者：
Cuesta, David [1 ]
Risco-Martin, Jose L. [1 ]
Ayala, Jose L. [1 ]
机构：
[1] Fac Informat, Madrid 28040, Spain
来源：
MICROPROCESSORS AND MICROSYSTEMS | 2012年 / 36卷 / 05期
基金：
瑞士国家科学基金会;
关键词：
Design; Performance; Real-time and embedded systems; Problem Solving; Control Methods and Search Heuristic methods;
D O I：
10.1016/j.micpro.2012.02.012
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
One of the most important concerns in 3D technology is heat removal. In this paper we propose a 3D thermal-aware floorplanner. Our contributions include: (1) a novel multi-objective formulation to consider the thermal and performance constraints in the optimization approach; (2) an efficient Mixed Integer Linear Programming (MILP) representation of the floorplanning model; and (3) a smooth integration of the MILP model with an accurate thermal modelling of the architecture. The experimental results for several realistic 3D stacks based on the Niagara system show promising improvements of the main thermal metrics, with a reduced overhead in the wire length of the system. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码：344 / 354
页数：11
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