A comparison of resistive switching parameters for memristive devices with HfO2 monolayers and Al2O3/HfO2 bilayers at the wafer scale

被引:0
|
作者
Perez, Eduardo [1 ,2 ]
Perez, Eduardo [1 ,2 ]
Maldonado, David [3 ]
Mahadevaiah, Mamathamba K. [1 ]
Quesada, Emilio Perez-Bosch [1 ]
Cantudo, Antonio [3 ]
Jimenez-Molinos, Francisco [3 ]
Wenger, Christian [1 ,2 ]
Wenger, Christian [1 ,2 ]
Roldan, Juan B. [3 ]
机构
[1] IHP Leibniz Inst Fuer Innovat Mikroelektron, Frankfurt, Germany
[2] BTU Cottbus Senftenberg, Cottbus, Germany
[3] Univ Granada, Dept Elect & Tecnol Computadores, Granada, Spain
关键词
Cycle-to-cycle variability; device-to-device variability; memristive device; monolayer; bilayer; parameter extraction; wafer-scale;
D O I
10.1109/CDE58627.2023.10339417
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Memristive devices integrated in 200 mm wafers manufactured in 130 nm CMOS technology with two different dielectrics, namely, a HfO2 monolayer and an Al2O3/HfO2 bilayer, have been measured. The cycle-to-cycle (C2C) and device-to-device (D2D) variability have been analyzed at the wafer scale using different numerical methods to extract the set (V-set) and reset (V-reset) voltages. Some interesting differences between both technologies were found in terms of switching characteristics.
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页数:5
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