Combining Built-In Redundancy Analysis with ECC for Memory Testing

被引:0
|
作者
Romain, Luc [1 ]
Nordmann, Paul-Patrick [2 ]
Nadeau-Dostie, Benoit [1 ]
Schramm, Lori [3 ]
Keim, Martin [4 ]
机构
[1] Siemens Digital Ind Software, Ottawa, ON, Canada
[2] Siemens Digital Ind Software, Hamburg, Germany
[3] Siemens Digital Ind Software, Atlanta, GA USA
[4] Siemens Digital Ind Software, Orlando, FL USA
关键词
Error Correction Codes (ECC); Built-In Redundancy Analysis (BIRA); Built-In Self Repair (BISR);
D O I
10.1109/ETS61313.2024.10567190
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Error Correction Codes (ECC) in current designs typically serve two purposes. For emerging non-volatile memory types (NVM), such as embedded magnetoresistive random access memory (eMRAM), ECC is necessary to counter the probabilistic behavior of the NVM, rendering the combined NVM/ECC a deterministic memory again. The second and much more prominent usage of ECC today is to protect the system against transient faults in the memory, here typically for SRAMs. On the other hand, new defect types for such emerging memories and new technology nodes may exceed reasonable costs of conventional row and column repair. To improve yield, users explore ECC as an option to augment the repair capability of the memory. This paper brings such an augmentation into a standard memory test and repair flow. It allows a user-defined, post silicon trade-off of using all or parts of the corrective power of the ECC for yield improvements and/or for system protection. Experimental results underline the very low area cost of this augmentation.
引用
收藏
页数:6
相关论文
共 50 条
  • [1] Dynamic Built-In Redundancy Analysis for Memory Repair
    Lee, Hayoung
    Han, Donghyun
    Lee, Seungtaek
    Kang, Sungho
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2019, 27 (10) : 2365 - 2374
  • [2] Built-in redundancy analysis for memory yield improvement
    Huang, CT
    Wu, CF
    Li, JF
    Wu, CW
    IEEE TRANSACTIONS ON RELIABILITY, 2003, 52 (04) : 386 - 399
  • [3] DFT techniques for memory macro with built-in ECC
    Kushida, K
    Otsuka, N
    Hirabayashi, O
    Takeyama, Y
    2005 IEEE International Workshop on Memory Technology, Design, and Testing - Proceedings, 2005, : 109 - 114
  • [4] A New Built-in Redundancy Analysis Algorithm Based On Multiple Memory Blocks
    Kim, Jooyoung
    Cho, Keewon
    Lee, Woosung
    Kang, Sungho
    2015 INTERNATIONAL SOC DESIGN CONFERENCE (ISOCC), 2015, : 43 - 44
  • [5] Hardware-Efficient Built-In Redundancy Analysis for Memory With Various Spares
    Kim, Jooyoung
    Lee, Woosung
    Cho, Keewon
    Kang, Sungho
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2017, 25 (03) : 844 - 856
  • [6] A Built-In Redundancy Analysis with a Minimized Binary Search Tree
    Cho, Hyungjun
    Kang, Wooheon
    Kang, Sungho
    ETRI JOURNAL, 2010, 32 (04) : 638 - 641
  • [7] Optimized counting threshold Built-in redundancy analysis for memories
    Karthy, Gopalan
    Sivakumar, Pothiraj
    MICROPROCESSORS AND MICROSYSTEMS, 2021, 81
  • [8] A Built-In Redundancy-Analysis Scheme for RAMs with 3D Redundancy
    Chang, Yi-Ju
    Huang, Yu-Jen
    Li, Jin-Fu
    2011 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2011, : 264 - 267
  • [9] Efficient built-in redundancy analysis for embedded memories with 2-D redundancy
    Lu, SK
    Tsai, YC
    Hsu, CH
    Wang, KH
    Wu, CW
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2006, 14 (01) : 34 - 42
  • [10] BUILT-IN TESTING OF MEMORY USING AN ON-CHIP COMPACT TESTING SCHEME
    KINOSHITA, K
    SALUJA, KK
    IEEE TRANSACTIONS ON COMPUTERS, 1986, 35 (10) : 862 - 870