Combining Built-In Redundancy Analysis with ECC for Memory Testing

被引:0
|
作者
Romain, Luc [1 ]
Nordmann, Paul-Patrick [2 ]
Nadeau-Dostie, Benoit [1 ]
Schramm, Lori [3 ]
Keim, Martin [4 ]
机构
[1] Siemens Digital Ind Software, Ottawa, ON, Canada
[2] Siemens Digital Ind Software, Hamburg, Germany
[3] Siemens Digital Ind Software, Atlanta, GA USA
[4] Siemens Digital Ind Software, Orlando, FL USA
来源
IEEE EUROPEAN TEST SYMPOSIUM, ETS 2024 | 2024年
关键词
Error Correction Codes (ECC); Built-In Redundancy Analysis (BIRA); Built-In Self Repair (BISR);
D O I
10.1109/ETS61313.2024.10567190
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Error Correction Codes (ECC) in current designs typically serve two purposes. For emerging non-volatile memory types (NVM), such as embedded magnetoresistive random access memory (eMRAM), ECC is necessary to counter the probabilistic behavior of the NVM, rendering the combined NVM/ECC a deterministic memory again. The second and much more prominent usage of ECC today is to protect the system against transient faults in the memory, here typically for SRAMs. On the other hand, new defect types for such emerging memories and new technology nodes may exceed reasonable costs of conventional row and column repair. To improve yield, users explore ECC as an option to augment the repair capability of the memory. This paper brings such an augmentation into a standard memory test and repair flow. It allows a user-defined, post silicon trade-off of using all or parts of the corrective power of the ECC for yield improvements and/or for system protection. Experimental results underline the very low area cost of this augmentation.
引用
收藏
页数:6
相关论文
共 50 条
  • [31] Design and Implementation of a New Symmetric Built-In Redundancy Analyzer
    Habiby, Payam
    Asli, Rahebeh Niaraki
    2012 16TH CSI INTERNATIONAL SYMPOSIUM ON COMPUTER ARCHITECTURE AND DIGITAL SYSTEMS (CADS), 2012, : 99 - 103
  • [32] SELECTOR-LINE MERGED BUILT-IN ECC TECHNIQUE FOR DRAMS
    YAMADA, J
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1987, 22 (05) : 868 - 873
  • [33] Effective Spare Line Allocation Built-in Redundancy Analysis With Base Common Spare for Yield Improvement of 3D Memory
    Han, Donghyun
    Lee, Hayoung
    Kang, Sungho
    IEEE ACCESS, 2021, 9 : 76716 - 76729
  • [34] A New Approach to the Design of Built-in Internal Memory Self-Testing Devices
    Ivanyuk, A. A.
    Yarmolik, V. N.
    AUTOMATIC CONTROL AND COMPUTER SCIENCES, 2008, 42 (04) : 169 - 174
  • [35] Built-In Functional Testing of Analog In-Memory Accelerators for Deep Neural Networks
    Mishra, Abhishek Kumar
    Das, Anup Kumar
    Kandasamy, Nagarajan
    ELECTRONICS, 2022, 11 (16)
  • [36] Combining scan test and built-in self test
    Seuring, Markus
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2006, 22 (03): : 297 - 299
  • [37] Combining Scan Test and Built-in Self Test
    Markus Seuring
    Journal of Electronic Testing, 2006, 22 : 297 - 299
  • [38] Near Optimal Repair Rate Built-in Redundancy Analysis with Very Small Hardware Overhead
    Lee, Woosung
    Cho, Keewon
    Kim, Jooyoung
    Kang, Sungho
    PROCEEDINGS OF THE SIXTEENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2015), 2015, : 430 - 434
  • [39] SPOT: Fast and Optimal Built-In Redundancy Analysis Using Smart Potential Case Collection
    Han, Donghyun
    Kim, Sunghoon
    Kim, Dayoung
    Kang, Sungho
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2025, 33 (03) : 780 - 792
  • [40] Crosstalk Logic Circuits with Built-in Memory
    Macha, Naveen Kumar
    Samant, Prerana
    Rahman, Mostafizur
    2021 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2021), 2021, : 79 - 83