共 50 条
- [3] KEYNOTE PAPER - MULTICHIP-MODULE TECHNOLOGY [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1983, 62 (08): : 875 - 875
- [4] THE HOW AND WHY OF MULTICHIP-MODULE TESTING [J]. EE-EVALUATION ENGINEERING, 1994, 33 (09): : 94 - &
- [5] ANALYZING MULTICHIP-MODULE TESTING STRATEGIES [J]. IEEE DESIGN & TEST OF COMPUTERS, 1994, 11 (01): : 40 - 52
- [6] SMART-SUBSTRATE MULTICHIP-MODULE SYSTEMS [J]. IEEE DESIGN & TEST OF COMPUTERS, 1994, 11 (02): : 64 - 73
- [7] THE MULTICHIP-MODULE AS A BOARD-LEVEL PACKAGE [J]. JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1995, 47 (06): : 27 - 30
- [8] POWER CYCLING AND STRESS VARIATION IN A MULTICHIP-MODULE [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 388 - 395