KEYNOTE PAPER - MULTICHIP-MODULE TECHNOLOGY

被引：0
|
作者：
RINNE, RA [1 ]
BARBOUR, DR [1 ]
机构：
[1] IBM CORP,HOPEWELL JUNCTION,NY 12533
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1983年 / 62卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：875 / 875
页数：1
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