共 50 条
- [21] A COMPUTER-AIDED-DESIGN TOOL FOR ROBUST MULTICHIP-MODULE PACKAGE DESIGN [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (03): : 383 - 394
- [22] THERMAL DESIGN FOR HIGH-SPEED HIGH-DENSITY MULTICHIP-MODULE [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (04): : 384 - 387
- [24] THE STATUS-QUO AND TRENDS IN THE DEVELOPMENT OF A MULTICHIP-MODULE FOR ATM SWITCHING-SYSTEM [J]. NEC RESEARCH & DEVELOPMENT, 1995, 36 (02): : 293 - 302
- [25] LIQUID COOLING PERFORMANCE FOR A 3-D MULTICHIP-MODULE AND MINIATURE HEAT SINK [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (01): : 68 - 73
- [27] PHOTOTHERMAL FORMATION OF COPPER CONDUCTORS ON MULTICHIP-MODULE SUBSTRATES USING A ND-YAG LASER [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (05): : 530 - 535
- [28] COMPARISON OF METHODS FOR DETERMINING THE CAPACITANCE OF PLANAR TRANSMISSION-LINES WITH APPLICATION TO MULTICHIP-MODULE CHARACTERIZATION [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (03): : 247 - 252
- [29] Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (12): : 2171 - 2182
- [30] PALLADIUM THIN-FILM RESISTORS FOR JOSEPHSON LSI CIRCUITS [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (08): : 2550 - 2553