SUPERCONDUCTOR WIRING IN MULTICHIP-MODULE FOR JOSEPHSON LSI CIRCUITS

被引:10
|
作者
TANAHASHI, S [1 ]
KUBO, T [1 ]
KAWABATA, K [1 ]
JIKUHARA, R [1 ]
KAJI, G [1 ]
TERASAWA, M [1 ]
NAKAGAWA, H [1 ]
AOYAGI, M [1 ]
KUROSAWA, I [1 ]
TAKADA, S [1 ]
机构
[1] ELECTROTECH LAB,TSUKUBA 305,JAPAN
来源
关键词
SUPERCONDUCTING MULTICHIP MODULE; NB POLYIMIDE SUPERCONDUCTOR WIRING; JOSEPHSON LSI;
D O I
10.1143/JJAP.32.L898
中图分类号
O59 [应用物理学];
学科分类号
摘要
Nb/polyimide stacked layers on a multilayer ceramic substrate makes it possible to fabricate superconducting off-chip wiring for control signal lines. This superconducting multichip module (SuperMCM) also provides matching circuits for the clock signal and DC bias circuits beneath the superconducting transmission lines. The first prototype SuperMCM in the world successfully made,which has been designed to drive Josephson LSI chips at the highest clock frequency of 1.2 GHz.
引用
收藏
页码:L898 / L900
页数:3
相关论文
共 50 条
  • [21] A COMPUTER-AIDED-DESIGN TOOL FOR ROBUST MULTICHIP-MODULE PACKAGE DESIGN
    KATRAGADDA, P
    BHATTACHARYA, S
    GROSSE, IR
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (03): : 383 - 394
  • [22] THERMAL DESIGN FOR HIGH-SPEED HIGH-DENSITY MULTICHIP-MODULE
    HANDA, T
    IIDA, S
    UTSUNOMIYA, J
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (04): : 384 - 387
  • [23] ADOPTING MULTICHIP-MODULE TECHNOLOGY - GOING TO MCMS ISNT AS SCARY AS ITS SEEMS ANYMORE
    TASKER, SC
    SEKULIC, Z
    [J]. ELECTRONIC DESIGN, 1994, 42 (13) : 153 - &
  • [24] THE STATUS-QUO AND TRENDS IN THE DEVELOPMENT OF A MULTICHIP-MODULE FOR ATM SWITCHING-SYSTEM
    KIKKAWA, T
    IKEDA, R
    HIGAKE, M
    [J]. NEC RESEARCH & DEVELOPMENT, 1995, 36 (02): : 293 - 302
  • [25] LIQUID COOLING PERFORMANCE FOR A 3-D MULTICHIP-MODULE AND MINIATURE HEAT SINK
    VOGEL, MR
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (01): : 68 - 73
  • [26] Characterisation and application of embedded lumped elements in multilayer advanced thick-film multichip-module technology
    Samanta, K. K.
    Robertson, I. D.
    [J]. IET MICROWAVES ANTENNAS & PROPAGATION, 2012, 6 (01) : 52 - 59
  • [27] PHOTOTHERMAL FORMATION OF COPPER CONDUCTORS ON MULTICHIP-MODULE SUBSTRATES USING A ND-YAG LASER
    MULLER, HG
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (05): : 530 - 535
  • [28] COMPARISON OF METHODS FOR DETERMINING THE CAPACITANCE OF PLANAR TRANSMISSION-LINES WITH APPLICATION TO MULTICHIP-MODULE CHARACTERIZATION
    LIPA, S
    STEER, MB
    MORRIS, AS
    FRANZON, PD
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (03): : 247 - 252
  • [29] Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems
    Chaudhary, Muhammad Waqas
    Heinig, Andy
    Choubey, Bhaskar
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (12): : 2171 - 2182
  • [30] PALLADIUM THIN-FILM RESISTORS FOR JOSEPHSON LSI CIRCUITS
    NAKAGAWA, H
    AOYAGI, M
    KUROSAWA, I
    TAKADA, S
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (08): : 2550 - 2553