REACTIVE SPUTTERING OF COPPER AND SILICON NEAR THE SPUTTERING THRESHOLD

被引：12

作者：

MAYER, TM ^{[1
]}

HARPER, JME ^{[1
]}

CUOMO, JJ ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 04期

关键词：

D O I：

10.1116/1.573378

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1779 / 1783

页数：5

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