REACTIVE SPUTTERING OF COPPER AND SILICON NEAR THE SPUTTERING THRESHOLD

被引：12
|
作者：
MAYER, TM [1 ]
HARPER, JME [1 ]
CUOMO, JJ [1 ]
机构：
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 04期
关键词：
D O I：
10.1116/1.573378
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：1779 / 1783
页数：5
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