共 50 条
- [1] Thermal, mechanical, and electrical study of voiding in the solder die-attach of power MOSFETs [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (01): : 127 - 136
- [2] Effect of die-attach adhesives on the stress evolution in MEMS packaging [J]. 2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2003, 5288 : 847 - 852
- [3] Optical probes and electrical resistivity measurements of conductive die attach adhesives [J]. ELECTRONIC PACKAGING MATERIALS SCIENCE X, 1998, 515 : 245 - 250
- [4] Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (01): : 8 - 15
- [5] The Humidity and Thermal Characteristics of Die-Attach (DA) and its Impact on the Package Reliability [J]. 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 729 - 734
- [6] Precision measurement and mapping of die-attach thermal resistance [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (03): : 506 - 514
- [7] VOLATILE SPECIES FROM CONDUCTIVE DIE ATTACH ADHESIVES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 571 - 577
- [8] Effects of Surface Treatments on the Performance of High Thermal Conductive Die Attach Adhesives (DAAs) [J]. 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,