Optical probes and electrical resistivity measurements of conductive die attach adhesives

被引:2
|
作者
Miragliotta, J [1 ]
Benson, RC [1 ]
Phillips, TE [1 ]
Emerson, JA [1 ]
机构
[1] Johns Hopkins Univ, Appl Phys Lab, Laurel, MD 20723 USA
来源
关键词
D O I
10.1557/PROC-515-245
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An important phenomenon in silver (Ag) particle-filled adhesives is the development of electrical conductivity as the polymer composite is cured. We report the results of optical and electrical measurements performed on a commercially available Ag particle/polymer composite as a function of sample temperature. Surface enhanced Raman scattering (SERS) was used to probe the chemical nature of the Ag interface while a four-point contact probe monitored the onset of DC electrical conductivity. Complementary to the die attach adhesives studies, SERS experiments were also performed on commercially available neat Ag flake with controlled adsorbate coverages. For both the neat flake and filled adhesive, a carboxylate layer was attached to an oxygen-covered Ag flake surface via the carboxylic acid end of the molecule. The SERS results observed a partial decomposition of the carboxylate species into an amorphous carbon layer upon an increase in the temperature of both the flake and filled adhesive samples. However, the temperature threshold for the chemical conversion was lower for the Ag-filled adhesive relative to the neat flake. In the composite samples, the formation of the amorphous carbon layer occurred well below the curing temperature and coincided with a corresponding decrease in the electrical resistivity of the adhesive. Thus, an initial step in developing electrical conductivity appears to be the partial conversion of the lubricant adsorbate to an amorphous carbon layer.
引用
收藏
页码:245 / 250
页数:6
相关论文
共 50 条
  • [1] VOLATILE SPECIES FROM CONDUCTIVE DIE ATTACH ADHESIVES
    BENSON, RC
    PHILLIPS, TE
    DEHAAS, N
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 571 - 577
  • [3] Study of processing variables on the electrical resistivity of conductive adhesives
    Wu, Zhenhua
    Li, Jianzhi
    Timmer, Douglas
    Lozano, Karen
    Bose, Subhash
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2009, 29 (05) : 488 - 494
  • [4] Curing and electrical conductivity of conductive glues for die attach in microelectronics
    Scandurra, A
    Cavallaro, A
    Pignataro, S
    Tiziani, R
    Gobbato, L
    Cognetti, C
    [J]. SURFACE AND INTERFACE ANALYSIS, 2006, 38 (04) : 429 - 432
  • [5] Effect of different copper fillers on the electrical resistivity of conductive adhesives
    Ho, Li-Ngee
    Nishikawa, Hiroshi
    Takemoto, Tadashi
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (05) : 538 - 544
  • [6] Effect of different copper fillers on the electrical resistivity of conductive adhesives
    Li-Ngee Ho
    Hiroshi Nishikawa
    Tadashi Takemoto
    [J]. Journal of Materials Science: Materials in Electronics, 2011, 22 : 538 - 544
  • [7] No-bleed die attach adhesives
    Neff, B
    Huneke, J
    Nguyen, A
    Liu, P
    Herrington, T
    Gupta, SK
    [J]. 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 79 - 81
  • [8] SILVER-INDUCED VOLATILE SPECIES GENERATION FROM CONDUCTIVE DIE ATTACH ADHESIVES
    PHILLIPS, TE
    DEHAAS, N
    GOODWIN, PG
    BENSON, RC
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (06): : 956 - 963
  • [9] Optical Interaction Between LED Backside Reflectors and Die Attach Adhesives
    Shih, Yu-Chou
    Kim, Gunwoo
    You, Jiun-Pyng
    Shi, Frank G.
    [J]. IEEE PHOTONICS TECHNOLOGY LETTERS, 2016, 28 (13) : 1446 - 1449
  • [10] Effects of Surface Treatments on the Performance of High Thermal Conductive Die Attach Adhesives (DAAs)
    Liu, Chenmin
    Lu, Dong
    Lang, Xianxin
    Choi, Ashley
    Lee, Peter W. M.
    [J]. 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,