共 50 条
- [31] Highly Thermal Conductive Transparent Die Attach Material for LEDs [J]. 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
- [33] SILVER-INDUCED VOLATILE SPECIES GENERATION FROM CONDUCTIVE DIE ATTACH ADHESIVES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (06): : 956 - 963
- [34] Wafer Backside Coating™ of Electrically Conductive Die Attach Adhesives for Small IC Packaging [J]. 2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 750 - +
- [35] MONITORING THERMAL-PROCESSING OF AG GLASS DIE ATTACH ADHESIVES [J]. ADHESIVES AGE, 1995, 38 (02): : 43 - 44
- [37] The effect of reflow process on the physical properties of die attach adhesives [J]. PROCEEDINGS OF THE 30TH ANNIVERSARY EUROSENSORS CONFERENCE - EUROSENSORS 2016, 2016, 168 : 1613 - 1616
- [38] Effects of Die-attach Materials on the Optical Durability and Thermal Performances of HP-LED [J]. 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 1116 - 1119
- [39] Evaluation of area bonding conductive adhesives for flip chip attach of area bonded die [J]. NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 476 - 481
- [40] Effects of Silver Microparticles and Nanoparticles on Thermal and Electrical Characteristics of Electrically Conductive Adhesives [J]. Journal of Electronic Materials, 2017, 46 : 6727 - 6735