共 50 条
- [1] Processing diagrams for polymeric die attach adhesives [J]. 47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 536 - 543
- [2] Die attach thermal monitoring of IGBT devices [J]. PROCEEDINGS OF THE INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2006, : 421 - 424
- [3] Processing-adhesion relations for die attach adhesives and underfill resins [J]. 3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 160 - 167
- [4] No-bleed die attach adhesives [J]. 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 79 - 81
- [7] No-bleed die attach adhesives. [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2005, 229 : U913 - U913
- [8] Moisture absorption and stress in die attach adhesives [J]. 1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 969 - 974
- [9] Effects of Surface Treatments on the Performance of High Thermal Conductive Die Attach Adhesives (DAAs) [J]. 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,
- [10] Test vehicle for studying thermal conductivity of die attach adhesives for high temperature electronics [J]. ADVANCED MATERIALS AND STRUCTURES IV, 2012, 188 : 238 - 243