APPLICATION OF ELECTROCHEMICAL ETCH-STOP IN PROCESSING SILICON ACCELEROMETER

被引:0
|
作者
MOTAMDEI, ME
ANDREWS, AP
COLTON, R
STAPLES, EJ
MULLER, RS
CHEN, P
机构
[1] ROCKWELL INT,THOUSAND OAKS,CA 91360
[2] UNIV CALIF BERKELEY,BERKELEY,CA 94720
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C98 / C98
页数:1
相关论文
共 50 条
  • [1] A machine for electrochemical etch-stop
    Zhou, K
    Lan, MJ
    Chen, WP
    Wang, DH
    [J]. INTERNATIONAL CONFERENCE ON SENSOR TECHNOLOGY (ISTC 2001), PROCEEDINGS, 2001, 4414 : 382 - 385
  • [2] STUDY OF THE ETCH-STOP MECHANISM IN SILICON
    PALIK, ED
    FAUST, JW
    GRAY, HF
    GREENE, RF
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (09) : 2051 - 2059
  • [3] ELECTROCHEMICAL ETCH-STOP CONTROL FOR SILICON STRUCTURES CONTAINING ELECTRONIC COMPONENTS
    GEALER, RL
    HAMMERLE, RH
    KARSTEN, H
    WROBLOWA, HS
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1988, 18 (03) : 463 - 468
  • [4] PASSIVATION ANALYSIS OF MICROMECHANICAL SILICON STRUCTURES OBTAINED BY ELECTROCHEMICAL ETCH-STOP
    GOTZ, A
    ESTEVE, J
    BAUSELLS, J
    MARCO, S
    SAMITIER, J
    MORANTE, JR
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 1993, 37-8 : 744 - 750
  • [5] IMPLANTED CARBON - AN EFFECTIVE ETCH-STOP IN SILICON
    LEHMANN, V
    MITANI, K
    FEIJOO, D
    GOSELE, U
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1991, 138 (05) : L3 - L4
  • [6] Nitrogen implanted etch-stop layers in silicon
    [J]. Paneva, R., 1600, Elsevier Science B.V., Amsterdam, Netherlands (27): : 1 - 4
  • [7] AN ELECTROCHEMICAL P-N-JUNCTION ETCH-STOP FOR THE FORMATION OF SILICON MICROSTRUCTURES
    JACKSON, TN
    TISCHLER, MA
    WISE, KD
    [J]. ELECTRON DEVICE LETTERS, 1981, 2 (02): : 44 - 45
  • [8] STUDY OF ELECTROCHEMICAL ETCH-STOP FOR HIGH-PRECISION THICKNESS CONTROL OF SILICON MEMBRANES
    KLOECK, B
    COLLINS, SD
    DEROOIJ, NF
    SMITH, RL
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (04) : 663 - 669
  • [9] Anisotropic etching and electrochemical etch-stop properties of silicon in TMAH:IPA:pyrazine solutions
    Chung, GS
    [J]. METALS AND MATERIALS INTERNATIONAL, 2001, 7 (06) : 643 - 649
  • [10] Anisotropic etching and electrochemical etch-stop properties of silicon in TMAH:IPA:pyrazine solutions
    Gwiy-Sang Chung
    [J]. Metals and Materials International, 2001, 7 : 643 - 649