ASIC DESIGN - HIGH-DENSITY ICS NEED DESIGN-FOR-TEST METHODS

被引：0
|
作者：
MARKOWITZ, MC
机构：
来源：
EDN | 1988年 / 33卷 / 24期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：73 / &
相关论文
共 50 条
  • [1] Design-for-test methodologies and tools for ASIC design
    Strickland, Terry
    Electronic Products (Garden City, New York), 1995, 38 (01):
  • [2] DESIGN-FOR-TEST METHODOLOGIES AND TOOLS FOR ASIC DESIGN
    STRICKLAND, T
    ELECTRONIC PRODUCTS MAGAZINE, 1995, 38 (01): : 25 - &
  • [3] The Electrical Design of High-speed and High-density ASIC Package
    Tao, Wenjun
    Li, Jun
    Zhou, Yunyan
    Wang, Qidong
    Cao, Liqiang
    Guidotti, Daniel
    Wan, Lixi
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 497 - 499
  • [4] Design-for-test techniques
    Lovelace, ME
    AUTOTESTCON '97 - IEEE SYSTEMS READINESS TECHNOLOGY CONFERENCE, 1997 IEEE AUTOTESTCON PROCEEDINGS, 1997, : 390 - 393
  • [5] Area efficient layout design of CMOS circuit for high-density ICs
    Mishra, Vimal Kumar
    Chauhan, R. K.
    INTERNATIONAL JOURNAL OF ELECTRONICS, 2018, 105 (01) : 73 - 87
  • [6] HOW MUCH CAN DESIGN-FOR-TEST REDUCE THE NEED FOR TESTING
    GABAY, J
    COMPUTER DESIGN, 1990, 29 (17): : 94 - &
  • [7] IC design-for-test and testability features
    Press, Ron
    2008 IEEE AUTOTESTCON, VOLS 1 AND 2, 2008, : 407 - 410
  • [8] LASER PRINTER DESIGN STRATEGY EMPHASIZES DESIGN-FOR-TEST
    CHILD, J
    COMPUTER DESIGN, 1992, 31 (01): : 91 - 93
  • [9] HIGH-DENSITY PCB DESIGN
    不详
    ELECTRONICS & WIRELESS WORLD, 1989, 95 (1641): : 710 - 714
  • [10] High-density package design
    Sandhu, Javed
    Varga, Ed
    Advanced Packaging, 2005, 14 (05): : 24 - 25
12345