High-density package design

被引：0
|
作者：
Sandhu, Javed [1 ,2 ]
Varga, Ed [1 ]
机构：
[1] ASAT Inc., 6701 Koll Center Parkway, Pleasanton, CA 94566
[2] Design Services
来源：
Advanced Packaging | 2005年 / 14卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：24 / 25
相关论文
共 50 条
  • [1] The Electrical Design of High-speed and High-density ASIC Package
    Tao, Wenjun
    Li, Jun
    Zhou, Yunyan
    Wang, Qidong
    Cao, Liqiang
    Guidotti, Daniel
    Wan, Lixi
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 497 - 499
  • [2] High-Density DRAM Package Simulation
    Wan, Ng Hong
    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 700 - 704
  • [3] High-density EGA package design requires tools to analyze parasitics
    Small, CH
    COMPUTER DESIGN, 1997, 36 (12): : 46 - +
  • [4] Silicon interposer technology for high-density package
    Matsuo, M
    Hayasaka, N
    Okumura, K
    Hosomi, E
    Takubo, C
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1455 - 1459
  • [5] Motor controller squeezes into high-density package
    Granville, F
    EDN, 1997, 42 (02) : 18 - 18
  • [6] Electrical measurement, modeling and analysis for high-speed and high-density IC package design
    Shin, DH
    Brenneman, ME
    Seol, BS
    Kim, YG
    2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 47 - 51
  • [7] High-Density Package Substrate Using Organic Interposer
    Miki S.
    Tsukamoto K.
    Sakaguchi Y.
    Kajiki A.
    Journal of Japan Institute of Electronics Packaging, 2023, 26 (04) : 361 - 366
  • [8] Maskless Lithography for High-Density Package Redistribution Layers
    Murali, Prahalad
    Nimbalkar, Pratik
    Kathaperumal, Mohanalingam
    Losego, Mark D.
    Tummala, Rao
    Swaminathan, Madhavan
    2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 147 - 151
  • [9] High-density compliant die-package interconnects
    Muthukumar, Sriram
    Hill, Charles D.
    Ford, Stan
    Worwag, Wojciech
    Dambrauskas, Tony
    Challela, Palmer C.
    Dory, Thomas S.
    Patel, Neha M.
    Ramsay, Edward L.
    Chau, David S.
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1233 - +
  • [10] High-density IC/LSI package for communication electronics
    Suzuki, Hiromichi
    Endo, Tsuneo
    Hitachi Review, 1993, 42 (03): : 141 - 144
12345