共 50 条
- [2] Electrical measurement, modeling and analysis for high-speed and high-density IC package design 2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 47 - 51
- [3] High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 835 - 840
- [4] High-Density DRAM Package Simulation PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 700 - 704
- [5] ONE METHOD OF HIGH-DENSITY ASSEMBLY FOR LSI CHIPS ELECTRONICS & COMMUNICATIONS IN JAPAN, 1976, 59 (07): : 97 - 107
- [7] Silicon interposer technology for high-density package 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1455 - 1459
- [9] New simultaneous switching noise analysis and modeling for high-speed and high-density CMOS IC package design IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 303 - 312
- [10] New technology for high-density LSI mounting in consumer products Fujitsu Scientific and Technical Journal, 2007, 43 (01): : 41 - 49