PLASMA-ETCHING OF ORGANIC MATERIALS .2. POLYIMIDE ETCHING AND PASSIVATION DOWNSTREAM OF AN O2-CF4-AR MICROWAVE PLASMA

被引：38
|
作者：
VUKANOVIC, V [1 ]
TAKACS, GA [1 ]
MATUSZAK, EA [1 ]
EGITTO, FD [1 ]
EMMI, F [1 ]
HORWATH, RS [1 ]
机构：
[1] IBM CORP,DIV SYST TECHNOL,ENDICOTT,NY 13760
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1988年 / 6卷 / 01期
关键词：
D O I：
10.1116/1.584054
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：66 / 71
页数：6
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