PLASMA-ETCHING OF ORGANIC MATERIALS .2. POLYIMIDE ETCHING AND PASSIVATION DOWNSTREAM OF AN O2-CF4-AR MICROWAVE PLASMA

被引：38

作者：

VUKANOVIC, V ^{[1
]}

TAKACS, GA ^{[1
]}

MATUSZAK, EA ^{[1
]}

EGITTO, FD ^{[1
]}

EMMI, F ^{[1
]}

HORWATH, RS ^{[1
]}

机构：

[1] IBM CORP,DIV SYST TECHNOL,ENDICOTT,NY 13760

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1988年 / 6卷 / 01期

关键词：

D O I：

10.1116/1.584054

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：66 / 71

页数：6

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