The rapid advancement in nanoscale devices demands innovative gate dielectric materials to replace traditional Silicon dioxide. This paper investigates the electrical behavior and performance of a dual-gate FinFET employing different high-K gate dielectric materials (Silicon dioxide, Hafnium oxide, Titanium oxide) through ATLAS 2D simulation in 5 nm technology. We analyze how these high-K gate dielectric materials influence the device, focusing on performance enhancement. The study highlights various key performance parameters (ION\documentclass[12pt]{minimal}
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\begin{document}$$I_{ON}$$\end{document}, IOFF\documentclass[12pt]{minimal}
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\begin{document}$$R_{ON}$$\end{document}, TF, EV, VIL\documentclass[12pt]{minimal}
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\begin{document}$$V_{IH}$$\end{document}, NML\documentclass[12pt]{minimal}
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\begin{document}$$NM_{L}$$\end{document}, NMH\documentclass[12pt]{minimal}
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\begin{document}$$NM_{H}$$\end{document}) and reveals a significant performance improvement with HfO2\documentclass[12pt]{minimal}
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\begin{document}$$\textrm{HfO}_2$$\end{document} dielectric material in the proposed Dual-Gate FinFET. Achieving impressive performance parameters (ION\documentclass[12pt]{minimal}
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\begin{document}$$I_{ON}$$\end{document}: 21.59 mA, IOFF\documentclass[12pt]{minimal}
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\begin{document}$$I_{OFF}$$\end{document}: 21 μ\documentclass[12pt]{minimal}
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\begin{document}$$\mu$$\end{document}A, Maximum net Electric field: 1221290 V/cm, gm(max)\documentclass[12pt]{minimal}
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\begin{document}$$g_{m(max)}$$\end{document}: 0.05187 S, gds(max)\documentclass[12pt]{minimal}
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\begin{document}$$g_{ds(max)}$$\end{document}: 0.03462 S, RON(max)\documentclass[12pt]{minimal}
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\begin{document}$$R_{ON(max)}$$\end{document}: 25.93 kΩ\documentclass[12pt]{minimal}
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\begin{document}$$\Omega$$\end{document}, TFmax: 5.02, Gainmax\documentclass[12pt]{minimal}
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\begin{document}$$Gain_{max}$$\end{document}: 90.233, EVmax\documentclass[12pt]{minimal}
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\begin{document}$$EV_{max}$$\end{document}: 67.532 V, VIL\documentclass[12pt]{minimal}
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\begin{document}$$V_{IL}$$\end{document}: 0.21 V, VIH\documentclass[12pt]{minimal}
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\begin{document}$$V_{IH}$$\end{document}: 0.4 V, NML\documentclass[12pt]{minimal}
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\begin{document}$$NM_{L}$$\end{document}: 198 V, NMH\documentclass[12pt]{minimal}
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\begin{document}$$NM_{H}$$\end{document}: 600 V), this paper provides valuable insights for designing high-performance devices with HfO2\documentclass[12pt]{minimal}
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\begin{document}$$\textrm{HfO}_2$$\end{document} dielectric material.