共 50 条
- [31] Adaptive optics for three-dimensional optical data storage and micromachining THREE-DIMENSIONAL AND MULTIDIMENSIONAL MICROSCOPY: IMAGE ACQUISITION AND PROCESSING XIII, 2006, 6090
- [32] New three-dimensional integration technology using chip-to-wafer bonding to achieve ultimate super-chip integration JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (4B): : 3030 - 3035
- [35] Three-dimensional optical storage NANO-AND MICRO-OPTICS FOR INFORMATION SYSTEMS, 2003, 5225 : 78 - 92
- [36] Three-dimensional integration technology using self-assembly technique and super-chip integration PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2008, : 10 - 12
- [37] Three-dimensional reconstruction of absorbed data in thin photonic data storage media THREE-DIMENSIONAL IMAGING, VISUALIZATION, AND DISPLAY 2010 AND DISPLAY TECHNOLOGIES AND APPLICATIONS FOR DEFENSE, SECURITY, AND AVIONICS IV, 2010, 7690
- [38] Development of three-dimensional integration technology for highly parallel image-processing chip Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2000, 39 (5 B): : 2473 - 2477
- [39] Development of three-dimensional integration technology for highly parallel image-processing chip JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2000, 39 (4B): : 2473 - 2477
- [40] First Foundry Three-Dimensional Hall Effect Sensor for System-on-Chip Integration 2020 IEEE SENSORS, 2020,